KSW Microtec AG

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Manfred-von-Ardenne-Ring 12 01099 Dresden/Germany	Tel. (+49) 351-88960 10 Fax (+49) 351-88960 11

Thinlam^® - Travel on a New Path with eID Solutions

With its Thinlam® product family, KSW opens new possibilities for card manufacturing and has become a solution of choice for card manufacturers worldwide, especially for high security ID projects and for ePassport data page production. KSW’s unique and highly secure Thinlam^® lamination technology prevents counterfeiting and complies with international governmental security standards to generate new grades of freedom in contactless card manufacturing, without any security compromise.

Prelaminates and especially Thinlam® are made of different base substrates (PVC, Polycarbonate, Teslin ^®, PETG) and are featured as the thinnest RFID prelaminates available for HF and UHF applications, with a high surface quality without dents and dimples, the best crack resistance in the market, and good printability. The KSW UHF Thinlam^®, with consistent read range and performance, is especially applicable for US green cards, US passports and Canadian eDrivers licenses.

KSW Microtec offers innovative ICAO-compliant Thinlam® card components made of PVC and PC with contactless HF microcontrollers for enhanced national ID cards, which can also be used for passport data pages and meets state printer requirements according to ISO 10373-1.

KSW Microtec‘s innovative Thinlam® technology fulfills high security demands with thinness, durability, security and a diverse choice of RFID chips to enable individual card structures of eID cards for enhanced eGovernment applications.

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KSW HF & UHF Thinlam® family

KSW HF Thinlam® for secure eID cards

KSW HF inlays for diverse applications

Smart and Innovative RFID-Technologies

KSW is one of the world’s leading manufacturers and suppliers of contactless components for standard and customized applications. KSW’s inlays and prelaminates are applicable in diverse areas for secure and reliable identification worldwide. A wide product range covers the business segments of Access Control, eGovernment, ePayment, eTicketing and Asset Management.

The company operates on a success-oriented performance level with far-reaching expertise in the design of RFID components, High-End-Wafer technology, efficient Flip-Chip assembly technology and Thinlam® lamination. KSW Microtec has earned itself a leading position in the market as an ambitious and innovative RFID manufacturer. In order to differentiate itself in the marketplace and to ensure high quality standards, the company has combined its excellent technological know-how from an inhouse team of experts with an efficient process capability for high volume production.

The prime focus of KSW Microtec is to serve the markets with proven and state of the art HF (ISO 14443 and 15693) and UHF (ISO 18000-6c) solutions.

With a variety of secure and durable prelaminates and inlays, KSW Microtec supports the route to the adoption of passive contactless chip cards to make access control systems safer and more reliable.

Following the mass adoption of machine-readable eID documents worldwide, KSW Microtec is aimed to meet new challenges with its Thinlam ® technology and sets new, higher standards in contactless eID card manufacturing. With Thinlam®, KSW offers a new grade of freedom in manufacturing eGovernment documents and maintaining a high level of security features.

In the ePayment market, KSW Microtec’s products are already proven as a key security component in tens of millions of contactless credit cards and other form factors (e.g. payment sticker) in use today. The offering includes prelaminates, Thinlam^® and inlays with excellent optical appearance.

As a leading component supplier in eTicketing for major European cities and metropolitan areas worldwide, KSW’s inlays are seeing widespread adoption and provide maximum inlay flexibility for ticket converting cards and other form factors.

Furthermore, KSW Microtec provides highly qualified and robust HF and UHF RFID inlays and labels for a wide range of applications in asset management.

Tradition and quality have been the hallmarks of excellence at the KSW Microtec headquarters in Dresden since 1994. The company holds a MasterCard^® certificate for its Thinlam® and sticker products and its secure manufacturing site in Germany. Consequently, KSW is committed to work on continuous improvements and to set innovative trends with sustainable RFID solutions for all market sectors.

Core competencies

• KSW Microtec design and manufacturing of inlays, prelaminates and Thinlam^®
• Thinlam® product family – thinnest prelaminates available
• Reliable and secure HF and UHF inlays and prelaminates acc. to ISO 14443, ISO 15693 and ISO 18000-6c and semi active labels
• Efficient Flip-Chip assembly technology
• Wafer processing, Wafer bumping, Palladium Bumping, Gold Bumping, Grinding and Dicing
• DIN EN ISO 9001:2008, DIN EN ISO 14001:2004, MasterCard® CQM – Statement of Quality certified